 |
| Heat releasing / contact parts |
・Heat releasing parts for on-board electronic devices
・Functional plating of various contacts
|
|
Bonding Pads
(42Ni / 50Ni materials) |
Features / applications |
 |
Features)
■No need to select a front or back surface when solder joining with Al bonding
■Surface smoothness and uniformity
・Chemical polishing is concurrently used for plating activation pretreatment.
・Amorphous-like plating film
Applications)
■Automobile and industrial hybrid IC coupling parts |
Lead Frames
(Profile rolling and irregular shaped caulking) |
Features / Applications |
 |
Features)
■Thicknesses of thick-wall heat sinks and lead portions can be optionally set up.
・Profile rolled products and caulking of irregular-shaped parts
■Surface treatment with emphasis on joining function
・Al bonding characteristics, solderability and resin adhesion characteristics
Applications)
■Automobile and industrial mold packages |
Heat Spreaders
(for bare chips) |
Features / Applications |
 |
Features)
■It is easy to carry out solder joining due to solder pretreatment.
■Surface cleanliness
・Consistent water quality control of plating line
Application)
■Heat sinks for automobile and industrial bare chips |
|
 |
